11 hits
Thermal conduction, thermal stress, thermal deformation, phase change, casting
Thermal Analysis
Finite element analysis simulates temperature distribution and thermodynamic behaviors by solving equations of heat conduction, convection, and radiation:
Heat Conduction and Temperature Field:
Analyze heat dissipation of electronic devices (e.g., temperature distribution of chips) and thermal uniformity of materials in high-temperature furnaces.
Thermal Stress and Thermal Deformation:
Predict thermal fatigue of engine blades caused by temperature gradients and residual stress during welding processes.
Phase Change and Phase Field Simulation:
Study microstructural evolution during metal solidification (e.g., casting) and the impact of ice layer melting on structures.
Thermo-Fluid Coupling Analysis:
Simulate fluid-structure-thermal coupling in nuclear reactor cooling systems and fluid heat transfer efficiency of solar collectors.
Contact:
Prof. Tian：WhatsApp：+86 15029941570 | Mailbox：540673737@qq.com
we specialize in CAE finite element calculation and simulation, virtual prototyping and simulation testing, and product design optimization for enterprises and institutions.
