Thermal Analysis

Thermal Analysis

Finite element analysis simulates temperature distribution and thermodynamic behaviors by solving equations of heat conduction, convection, and radiation:
Heat Conduction and Temperature Field:

Analyze heat dissipation of electronic devices (e.g., temperature distribution of chips) and thermal uniformity of materials in high-temperature furnaces.
Thermal Stress and Thermal Deformation:

Predict thermal fatigue of engine blades caused by temperature gradients and residual stress during welding processes.
Phase Change and Phase Field Simulation:

Study microstructural evolution during metal solidification (e.g., casting) and the impact of ice layer melting on structures.
Thermo-Fluid Coupling Analysis:

Simulate fluid-structure-thermal coupling in nuclear reactor cooling systems and fluid heat transfer efficiency of solar collectors.

Contact:

Prof. Tian：WhatsApp：+86 15029941570 | Mailbox：540673737@qq.com